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US 2010/0148173 A1Published application
Semiconductor device and fabrication method for the same
AssigneePanasonic Corporation
InventorsMasao TAKAHASHI, Noriyuki Nagai
Life of this patent
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Abstract
A semiconductor device includes: a semiconductor element (1) having an internal circuit (17); and electrode pads (22, 22, . . . ) provided for the semiconductor element (1). The electrode pads (22, 22, . . . ) are electrically connected to the internal circuit (17) via control portions (31) for controlling electrical connection between the electrode pads (22, 22, . . . ) and the internal circuit (17).
Claims18
A semiconductor device, comprising:
- a semiconductor element having an internal circuit;
- and
- an electrode pad provided for the semiconductor element,
- wherein
- the electrode pad is electrically connected to the internal circuit via a control portion for controlling electrical connection between the electrode pad and the internal circuit.
2 more elements
A fabrication method for a semiconductor device, comprising the steps of:
- (a) preparing a wafer having a semiconductor element formed in each of a plurality of regions separated from each other with a scribe line, the semiconductor element having an internal circuit, an electrode pad, and a control portion electrically connected to the internal circuit and the electrode pad for controlling electrical connection between the internal circuit and the electrode pad;
- (b) determining whether or not leakage has occurred in the semiconductor element;
- (c) electrically insulating the internal circuit from the electrode pad with the control portion for a semiconductor element determined that leakage has occurred in the step (b);
- and
- (d) executing burn-in for the wafer after the step (c).
2 more elements
Dependencies are inferred from the claim text.