Semiconductor device
AssigneeElpida Memory, Inc.
InventorsMitsuhisa Watanabe, Keiyo Kusanagi
Life of this patent
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Abstract
A semiconductor device includes: a semiconductor chip; a plurality of electrode pads on the semiconductor chip; a wiring board fixed to the semiconductor chip; a plurality of connection pads on the wiring board; a plurality of bonding pads aligned along two sides of the wiring board; and a plurality of leads on the wiring board. The plurality of electrode pads is in a center region of the semiconductor chip. The plurality of second connection pads faces the plurality of electrode pads. The plurality of leads connects the plurality of connection pads to the plurality of bonding pads.
Claims20
A semiconductor device comprising:
- a first wiring board having first and second regions;
- a plurality of first connection pads in the first region;
- and
- a first semiconductor device covering the second region, the first semiconductor device comprising:
- a first semiconductor chip;
- a plurality of first electrode pads on the first semiconductor chip, the plurality of first electrode pads being in a center region of the first semiconductor chip;
- a second wiring board fixed to the first semiconductor chip;
- a plurality of second connection pads on the second wiring board, the plurality of second connection pads facing the plurality of first electrode pads;
- a plurality of first bonding pads aligned along two sides of the second wiring board, the plurality of first bonding pads connecting to the plurality of first connection pads;
- and
- a plurality of first leads on the second wiring board, the plurality of first leads connecting the plurality of second connection pads to the plurality of first bonding pads.
A semiconductor device comprising:
- a semiconductor chip;
- a plurality of electrode pads on the semiconductor chip, the plurality of electrode pads being in a center region of the semiconductor chip;
- a wiring board fixed to the semiconductor chip;
- a plurality of connection pads on the wiring board, the plurality of second connection pads facing the plurality of electrode pads;
- a plurality of bonding pads aligned along two sides of the wiring board;
- and
- a plurality of leads on the wiring board, the plurality of leads connecting the plurality of connection pads to the plurality of bonding pads.
Dependencies are inferred from the claim text.