Organic electronic devices protected by elastomeric laminating adhesive

Abstract

An active organic electronic component is protected within an organic electronic device by an elastomeric laminating adhesive, which adheres the substrate and cover of the electronic device and encloses and protects the active organic component within the device. The organic electronic device has a structure comprising (a) a substrate; (b) an active organic component disposed on the substrate, and optionally, a barrier coating disposed over the active organic component and over part of the substrate; (c) a cover, and optionally a getter associated with the cover; (d) a cured elastomeric laminating adhesive applied in the area between the substrate and the cover and closing the active organic component. The laminating adhesive may be theremally curable or curable by actinic radiation.

Dependencies are inferred from the claim text.