Organic light emitting apparatus and method of manufacturing the same
AssigneeSamsung Mobile Display Co., Ltd.
InventorsSeung-Yong Song, Kwan-Hee Lee, Young-Seo Choi, Oh-June Kwon, Sun-Young Jung, Ji-Hun Ryu, Young-Cheol Joo
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Abstract
Provided are an organic light emitting apparatus and a method of manufacturing the same. The organic light emitting apparatus includes: a filling material between a diode substrate on which an organic light emitting unit is formed and an encapsulation substrate; and an organic protection layer that is interposed between the organic light emitting unit and the filling material and includes at least one thermally depositable organic material.
Claims17
An organic light emitting apparatus comprising:
- a diode substrate;
- an organic emission unit that is disposed on the diode substrate and comprises at least one organic light emitting diode comprising a pair of electrodes and an organic layer interposed between the electrodes;
- an encapsulation substrate disposed above the organic emission unit;
- a sealant with which the diode substrate is attached to the encapsulation substrate;
- a filling material interposed between the diode substrate and the encapsulation substrate;
- and
- an organic protection layer that is interposed between the organic emission unit and the filling material and comprises at least one thermally depositable organic material.
A method of manufacturing an organic light emitting apparatus, the method comprising:
- forming on one surface of a diode substrate an organic light emitting unit that comprises at least one organic light emitting diode comprising a pair of electrodes and an organic layer interposed between the electrodes;
- thermally depositing at least one thermally depositable organic material on the organic emission unit, thereby forming an organic protection layer;
- preparing an encapsulation substrate;
- providing a filling material and a sealant to at least one of the diode substrate on which the organic light emitting unit and the organic protection layer are formed and the encapsulation substrate;
- and
- combining the diode substrate with the encapsulation substrate.
Dependencies are inferred from the claim text.