Method For Encapsulating An Electronic Arrangement
AssigneeTesa SE
InventorsJan ELLINGER, Klaus KEITE-TELGENBÜSCHER, Bernard MÜSSIG, Kerstin METZLER
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Abstract
A method for encapsulating an electronic, optionally optoelectronic, arrangement against permeants, in which a pressure-sensitive adhesive composition based on a partly crystalline polyolefin is applied onto and/or around the regions of the electronic arrangement which are to be encapsulated, wherein the polyolefin has a density between 0.86 and 0.89 g/cm and a crystallite melting point of at least 90° C.
Claims16
Method for encapsulating an electronic arrangement against permeants, said method comprising applying a pressure-sensitive adhesive composition based on a partly crystalline polyolefin onto and/or around regions of the electronic arrangement which are to be encapsulated, wherein the polyolefin has a density between 0.86 and 0.89 g/cm and a crystallite melting point of at least 90° C.
A process of preparing a pressure-sensitive adhesive composition for encapsulating an electronic arrangement against permeants, comprising formulating a partly crystalline polyolefin as a pressure-sensitive adhesive, wherein the polyolefin has a density of between 0.86 and 0.89 g/cm3, and the polyolefin has a crystallite melting point of at least 90° C.
Electronic arrangement comprising an electronic structure and a pressure-sensitive adhesive composition, wherein the electronic structure is at least partly encapsulated by the pressure-sensitive adhesive composition, and wherein the pressure-sensitive adhesive composition is based on a partly crystalline polyolefin having a density between 0.86 and 0.89 g/cm and a crystallite melting point of at least 90° C.
Dependencies are inferred from the claim text.