Electronic device housing
AssigneeMitsubishi Electric Corporation
InventorsToshikazu Satone, Mikio Iijima, Hajime Nakajima, Takashi Okamuro, Yohichi Ohmura
Life of this patent
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Abstract
An electronic device housing includes a metallic base part 101; a resin part 402 fixed to the base part 101; and a printed circuit board 104 coming into contact with the resin part 402; wherein bonding of the base part 101 to the resin part 402 is carried out by way of a nanomold technique and wherein the resin part 402 has insulating property.
Claims5
An encoder comprising:
- a base part made of aluminum;
- a resin part made of an insulating resin fixed to the base part;
- and
- a printed circuit board coming into contact with the resin part;
- and detecting a rotation of a pattern disc rotating while coupled to a rotary body;
- wherein the base part is bonded to the resin part through bonding in which asperities in the nanometer order formed on a fixing surface of the base part opposed to the resin part is bonded to a resin of the resin part by way of a key structure, and
- wherein the printed circuit board is mounted on the resin part so as to allow a pattern on the printed circuit board to be arranged on a contact surface of the resin part opposed to the printed circuit board.
An encoder manufacturing method for bonding a base part made of aluminum to a resin part made of an insulating resin and mounting a printed circuit board for detecting a rotation of a pattern disc rotating while coupled to a rotary body so as to cause the printed circuit board to come into contact with the resin part,
- wherein the method includes steps of:
- forming asperities in the nanometer order on a fixing surface of the base part to be fixed to the resin part;
- bonding the resin part to the fixing surface of the base part by way of a key structure through injection molding;
- and
- mounting the printed circuit board on the resin part so as to allow the pattern on the printed circuit board to be arranged on a contact surface of the resin part opposed to the printed circuit board.
(canceled)
Dependencies are inferred from the claim text.