Detector

A detector comprising:

• a first semiconductor substrate comprising an avalanche photodiode for detecting radiation, wherein the avalanche photodiode extends from a first main surface of the first semiconductor substrate to a second main surface of the first semiconductor substrate and comprises a first electrode at the first main surface and a second electrode at the second main surface, wherein the first main surface and the second main surface are opposite sides of the first semiconductor substrate, wherein the first electrode of the avalanche photodiode is connected to a first contact of the avalanche photodiode at the second main surface and the second electrode of the avalanche photodiode forms a second contact of the avalanche photodiode at the second main surface, wherein the first electrode of the avalanche photodiode and the first contact of the avalanche photodiode are connected by a trench, wherein the trench extends from the first main surface of the first semiconductor substrate to the second main surface of the first semiconductor substrate;
• and
• a second substrate comprising a control circuit, wherein the control circuit is connected to a first contact at a first main surface of the second substrate and a second contact at the first main surface of the second substrate, wherein an arrangement of the first contact and the second contact of the control circuit on the first main surface of the second substrate corresponds to a mirrored arrangement of the first contact and the second contact of the avalanche photodiode on the second main surface of the first semiconductor substrate, for providing a direct connection of the first semiconductor substrate and the second substrate,
• wherein the first contact of the avalanche photodiode is connected to the first contact of the control circuit and the second contact of the avalanche photodiode is connected to the second contact of the control circuit, and
• wherein the control circuit comprises an evaluation unit and a control unit, wherein the evaluation unit is configured to evaluate a signal from the avalanche photodiode and the control unit is configured to control the avalanche photodiode.

A method for detecting radiation or particles, comprising:

• detecting radiation or particles with a detector element, wherein the detector element is arranged in a first semiconductor substrate and extends from a first main surface of the first semiconductor substrate to a second main surface of the first semiconductor substrate and comprises a first electrode at the first main surface and a second electrode at the second main surface, wherein the first main surface and the second main surface are opposite sides of the first semiconductor substrate, wherein the first electrode of the detector element is connected to a first contact of the detector element at the second main surface and the second electrode of the detector element forms a second contact of the detector element at the second main surface;
• and
• evaluating a detector signal from the detector element with a control circuit, wherein the detector signal is caused by the detected radiation or the detected particle, wherein the control circuit is arranged at a second substrate and is connected to a first contact at a first main surface of the second substrate and a second contact at the first main surface of the second substrate, wherein an arrangement of the first contact and the second contact of the control circuit on the first main surface of the second substrate corresponds to a mirrored arrangement of the first contact and the second contact of the detector element on the second main surface of the first semiconductor substrate, whereby a direct connection of the first semiconductor substrate and the second substrate is enabled so that the first contact of the detector element is connected to the first contact of the control circuit and the second contact of the detector element is connected to the second contact of the control circuit.

A computer program comprising a program code for performing a method for detecting radiation or particles, the method comprising:

• detecting radiation or particles with a detector element, wherein the detector element is arranged in a first semiconductor substrate and extends from a first main surface of the first semiconductor substrate to a second main surface of the first semiconductor substrate and comprises a first electrode at the first main surface and a second electrode at the second main surface, wherein the first main surface and the second main surface are opposite sides of the first semiconductor substrate, wherein the first electrode of the detector element is connected to a first contact of the detector element at the second main surface and the second electrode of the detector element forms a second contact of the detector element at the second main surface;
• and
• evaluating a detector signal by a control circuit, wherein the detector signal is caused by the detected radiation or the detected particle, wherein the control circuit is arranged at a second substrate and is connected to a first contact at a first main surface of the second substrate and a second contact at the first main surface of the second substrate, wherein an arrangement of the first contact and the second contact of the control circuit on the first main surface of the second substrate corresponds to a mirrored arrangement of the first contact and the second contact of the detector element on the second main surface of the first semiconductor substrate, whereby a direct connection of the first semiconductor substrate and the second substrate is enabled so that the first contact of the detector element is connected to the first contact of the control circuit and the second contact of the detector element is connected to the second contact of the control circuit.