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US 2010/0147820 A1Published application
Heated cantilever
AssigneeNanoInk, Inc.
InventorsJoseph S. FRAGALA, Albert K. HENNING, Raymond Roger SHILE
Life of this patent
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Abstract
A device is provided comprising at least one cantilever comprising at least one tip and at least one heating element. Methods for making and using such a device are also provided.
Claims30
A device comprising at least one cantilever comprising at least one tip and at least one heating element, wherein said cantilever further comprises silicon nitride or silicon carbide, and wherein said one or more heating elements comprises gold, titanium, tungsten, doped silicon, or doped silicon carbide.
A method comprising:
- (i) forming at least one resistive region in a handle wafer;
- (ii) forming at least one cantilever disposed on said handle wafer;
- (iii) annealing said handle wafer for a time, wherein said time is sufficient to allow said at least one resistive region to contact said at least one cantilever;
- and
- (iv) separating at least a part of said handle wafer, so that said at least one cantilever and said at least one resistive region remain in contact.
2 more elements
A method comprising:
- (i) providing a device comprising at least one cantilever comprising at least one tip and at least one heating element, wherein said cantilever further comprises silicon nitride or silicon carbide, and wherein said one or more heating elements comprises gold, titanium, tungsten, doped silicon, or doped silicon carbide,
- (ii) providing at least one composition on said at least one tip, said at least one composition comprising at least one melting temperature,
- (iii) heating said at least one tip to at least one temperature using said at least one heating element, said at least one temperature being greater than said at least one melting temperature, and
- (iv) depositing said at least one composition on a surface.
1 more element
A method comprising:
- (i) providing a device comprising at least one cantilever comprising at least one tip and at least one heating element, wherein said cantilever further comprises silicon nitride or silicon carbide, and wherein said one or more heating elements comprises gold, titanium, tungsten, doped silicon, or doped silicon carbide,
- (ii) providing a surface with at least one composition disposed thereon, said at least one composition comprising at least one melting temperature,
- (iii) heating said at least one tip to at least one temperature using said at least one heating element, said at least one temperature being greater than said at least one melting temperature, and
- (iv) contacting said at least one tip to said at least one composition for a time sufficient to melt at least a portion of said at least one composition.
1 more element
A method comprising:
- (i) providing a device comprising at least one cantilever comprising at least one tip and at least one heating element, wherein said cantilever further comprises silicon nitride or silicon carbide, and wherein said one or more heating elements comprises gold, titanium, tungsten, doped silicon, or doped silicon carbide,
- (ii) providing a surface with at least one composition disposed thereon, said at least one composition comprising at least one decomposition temperature,
- (iii) heating said at least one tip to at least one temperature using said at least one heating element, said at least one temperature being greater than said at least one decomposition temperature, and
- (iv) contacting said at least one tip to said at least one composition for a time sufficient to decompose at least a portion of said at least one composition.
1 more element
Dependencies are inferred from the claim text.