Method of cutting plastic substrate and apparatus for cutting plastic substrate
AssigneeSharp Kabushiki Kaisha
InventorNoriko Watanabe
Life of this patent
Estimating the term…
Abstract
A laser emitter arranged to face a plastic substrate makes relative movement along a surface of the plastic substrate, while it is emitting a laser, so as to laser-cut the plastic substrate. In this process, a shield member is arranged outside a laser irradiation region on the plastic substrate.
Claims17
1-16. (canceled)
A method for laser-cutting a plastic substrate comprising:
- making relative movement of a laser emitter along a surface of the plastic substrate while the laser emitter emits a laser;
- wherein
- a shield member is arranged outside a laser irradiation region on the plastic substrate.
A method for laser-cutting a plastic substrate comprising:
- making relative movement of a laser emitter along a surface of the plastic substrate while the laser emits a laser;
- wherein
- an exhaust port of an exhaust system is arranged to face a laser irradiation region on the plastic substrate.
A method for laser-cutting a plastic substrate comprising:
- making relative movement of a laser emitter along a surface of the plastic substrate while the laser emitter emits a laser;
- wherein
- irradiation with the laser is performed with a surface of the plastic substrate opposite the emitter being in contact with liquid.
An apparatus for cutting a plastic substrate comprising:
- a stage on which the plastic substrate is placed;
- and
- a laser emitter arranged to face the stage and arranged to emit a laser while making relative movement along a surface of the plastic substrate to laser-cut the plastic substrate;
- wherein
- the apparatus includes a shield member arranged outside a laser irradiation region on the plastic substrate.
An apparatus for cutting a plastic substrate comprising:
- a stage on which the plastic substrate is placed;
- and
- a laser emitter arranged to face the stage and arranged to emit a laser while making relative movement along a surface of the plastic substrate to laser-cut the plastic substrate;
- wherein
- the apparatus includes an exhaust system having an exhaust port arranged to face a laser irradiation region on the plastic substrate.
An apparatus for cutting a plastic substrate comprising:
- a stage on which the plastic substrate is placed;
- and
- a laser emitter arranged to face the stage and arranged to emit a laser while making relative movement along a surface of the plastic substrate to laser-cut the plastic substrate;
- wherein
- the apparatus includes a storage tank containing liquid so that the liquid is in contact with a surface of the plastic substrate opposite the emitter.
Dependencies are inferred from the claim text.