Apparatus for laser scribing of dielectric-coated semiconductor wafers
OwnerMark S. Sobeyinventor
Life of this patent
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Abstract
A groove pattern is scribed into a silicon-nitride layer on a silicon wafer using four independently scanned, focused beams of laser radiation. Each focused beam is scannable within one of four scan-field positions on a turntable. The wafer is transported incrementally from the first scan-field position to the second, third and fourth scan-field positions. The scanned focused laser beam in each scan-field position scribes a portion of the groove pattern on the wafer, with scribing of the groove pattern being completed at the fourth scan-field position.
Claims20
Apparatus for scribing a pattern of grooves through a layer of dielectric material deposited on a semiconductor material, comprising:
- a turntable for supporting the material to be scribed;
- a plurality of laser beams provided by at least one laser;
- an arrangement for focusing and independently scanning each of the laser beams over a corresponding plurality of scan-field positions located around the turntable, the scan-field positions being located over the turntable such that when the material is supported on the turntable the material can be transported sequentially into each of the scan-field positions from a first of the scan-field positions to a last of the scan-field positions by incrementally rotating the turntable;
- and
- wherein the scanned focused laser beam in each of the scan-field positions is controllable to scribe a different portion of the groove pattern on the material, with a first portion of the pattern being scribed in the first scan-field position and a final portion of the pattern being scribed at the last scan-field position to complete the groove pattern.
Apparatus for scribing a pattern of grooves through a layer of a dielectric material deposited on a silicon wafer, comprising:
- a turntable for supporting the wafer to be scribed;
- an arrangement for providing four beams of laser radiation;
- an arrangement for focusing and independently scanning each of the laser-radiation beams over corresponding one of four scan-field positions located around the turntable, the scan-field positions being located over the turntable such that when the wafer is supported on the turntable the wafer can be transported sequentially into each of the scan-field positions from the first of the scan-field positions to a fourth of the scan-field positions by incrementally rotating the turntable;
- and
- wherein the scanned focused laser beam in each of the scan-field position is controllable to scribe a different portion of the groove pattern on the wafer, with a first portion of the pattern being scribed in the first scan-field position and a final portion of the pattern being scribed at the fourth scan-field position to complete the groove pattern.
A method of scribing a wafer with a pattern comprising the steps of:
- (a) providing a rotatable turntable with at least five positions for holding a wafer, with at least one of said positions for loading or unloading a wafer and the remaining four positions used for a scribing step;
- (b) laser scribing a portion of the pattern in each of four wafers located in the four positions;
- (c) loading an unscribed wafer onto the turntable;
- (d) rotating the turntable to index the wafers;
- (e) unloading a fully scribed wafer from the turntable;
- (f) laser scribing a portion of the pattern in each wafer in the four positions;
- and
- (g) repeating steps (c), (d), (e) and (f) until a complete pattern is formed on each wafer.
Dependencies are inferred from the claim text.