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US 2010/0147697 A1Published application
Method for electroplating a substrate
AssigneeShocking Technologies, Inc.
InventorsLex Kosowsky, Robert Fleming
Life of this patent
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Abstract
One or more embodiments provide for a device that utilizes voltage switchable dielectric material having semi-conductive or conductive materials that have a relatively high aspect ratio for purpose of enhancing mechanical and electrical characteristics of the VSD material on the device.
Claims1
A method for electroplating a substrate, the method comprising:
- applying a voltage switchable dielectric (VSD) material onto a target region of a device, said VSD material comprising:
- a binder;
- high aspect ratio (HAR) particles that are conductive or semi-conductive and dispersed as nanoscale particles within the binder;
- and
- conductor and/or semiconductor particles;
- said conductor and/or semiconductor particles being distributed in the binder;
- wherein HAR particles and said conductor and/or semiconductor particles are combined to provide said composition with a characteristic of being (i) dielectric in absence of a voltage that exceeds a characteristic voltage level, and (ii) conductive with application of said voltage exceeding said characteristic voltage level;
- forming a pattern using the VSD material;
- applying the voltage that exceeds the characteristic voltage level so that the VSD material is conductive;
- while applying the voltage, exposing the target region of the device to an electrolytic medium.
7 more elements
Dependencies are inferred from the claim text.