Laminated wiring board and method for manufacturing the same
AssigneeFujikura Ltd.
InventorTakaharu Hondo
Life of this patent
Estimating the term…
Abstract
Wiring board bases 2 to 4 are provided with: insulating substrates 1a to 4a having conductive layers 1b to 4b provided on one surfaces thereof, respectively; through-holes 2e to 4e which are arranged on the insulating substrates and reach the conductive layers from the other surfaces; and conductive vias 2d to 4d connected to the conductive layers by filling the through-holes with a conductive paste. In a method for manufacturing a laminated wiring board, at least one of the wiring board bases is stacked. Before the through-hole is filled with the conductive paste, a surface portion, in the through-hole, of the conductive layer is smoothed and a smooth surface portion 2g is formed.
Claims8
A method for manufacturing a laminated wiring board in which at least one wiring board base is stacked, comprising:
- providing a conductive layer on a first surface of an insulating substrate included in the wiring board base;
- providing a through-hole reaching the conductive layer from a second surface opposite to the first surface;
- smoothing a surface portion, in the through-hole, of the conductive layer;
- and
- forming a conductive via to be connected to the conductive layer by filling the through-hole with a conductive paste.
A laminated wiring board comprising:
- at least one wiring board base including
- an insulating substrate having a first surface and a second surface opposite to the first surface,
- a conductive layer provided on the first surface, and
- a conductive via including a through-hole reaching the conductive layer from the second surface and a conductive paste filled in the through-hole,
- wherein a maximum height roughness Rz of the surface portion, in the through-hole, of the conductive layer is 3 μm or less.
A laminated wiring board comprising:
- at least one wiring board base including
- an insulating substrate having a first surface and a second surface opposite to the first surface,
- a conductive layer provided on the first surface, and
- a conductive via including a through-hole reaching the conductive layer from the second surface and a conductive paste filled in the through-hole,
- wherein an arithmetic mean roughness Ra of the surface portion, in the through-hole, of the conductive layer is 1.0 μm or less.
A laminated wiring board comprising:
- at least one wiring board base including
- an insulating substrate having a first surface and a second surface opposite to the first surface,
- a conductive layer provided on the first surface, and
- a conductive via including a through-hole reaching the conductive layer from the second surface and a conductive paste filled in the through-hole, wherein the conductive paste forms an alloy layer between the conductive paste and the conductive layer, a thickness of the alloy layer is 0.5 to 2.0 μm, and the alloy layer contains any of Cu3Sn and Cu6Sn5.
Dependencies are inferred from the claim text.