Printed circuit board and manufacturing method thereof
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsHan-Ul Lee, Young-Hwan Shin, Jong-Jin Lee
Life of this patent
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Abstract
A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The method of manufacturing a printed circuit board can include: processing a first hole, which has a tapered shape, in one side of a substrate by using a laser drill; processing a second hole, which has a tapered shape and which connects with the first hole, in the other side of the substrate by using a laser drill in a position corresponding to that of the first hole; and forming a conductive portion, which electrically connects both sides of the substrate through the first hole and the second hole, by performing plating. This method may be used for providing reliable interlayer connections.
Claims10
A method of manufacturing a printed circuit board, the method comprising:
- processing a first hole by using a laser drill in one side of a substrate, the first hole having a tapered shape;
- processing a second hole by using a laser drill in the other side of the substrate in a position corresponding to a position of the first hole, the second hole having a tapered shape and connecting with the first hole;
- and
- forming a conductive portion by performing plating, the conductive portion electrically connecting both sides of the substrate by way of the first hole and the second hole.
A printed circuit board comprising:
- a substrate;
- a first hole formed in one side of the substrate, the first hole having a tapered shape;
- a second hole formed in the other side of the substrate and connected with the first hole, the second hole having a tapered shape;
- and
- a conductive portion electrically connecting both sides of the substrate by way of the first hole and the second hole.
Dependencies are inferred from the claim text.