US 2010/0147574 A1 · WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

Abstract

A wiring board (package) has a structure in which multiple wiring layers are stacked one on top of another with insulating layers each interposed between corresponding two of the wiring layers, and the wiring layers are connected to each other through vias formed in the insulating layers. In the peripheral region around the chip mounting area of the outermost insulating layer on one of both surfaces of the board, a pad is formed in a bump shape to cover a surface of a portion of the outermost insulating layer, the portion being formed to protrude, and a pad whose surface is exposed from the insulating layer is arranged in the chip mounting area. A chip is flip-chip bonded to the pad of the package, and another package is bonded to the bump shaped pad in a peripheral region around the chip (package-on-package bonding).

Claims10

Dependent claims

A wiring board having a structure in which a plurality of wiring layers are stacked one on top of another with insulating layers each interposed between corresponding two of the wiring layers, and the plurality of the wiring layers are connected to each other through vias formed in the insulating layers, the wiring board comprising:

a first pad which is arranged in a peripheral region around an electronic component mounting area of an outermost insulating layer on one of both surfaces of the wiring board, which is connected to a corresponding one of the vias, and which is formed in a bump shape to cover a surface of a portion of the outermost insulating layer, the portion being formed to protrude;
and
a second pad which is arranged in the electronic component mounting area, which is connected to a corresponding one of the vias, and a surface of which is exposed from the outermost insulating layer.

A method of manufacturing a wiring board, comprising:

forming a first resist layer on a support base material,
the first resist layer being patterned to have an opening portion in a manner to leave a portion corresponding to an electronic component mounting area, the opening portion corresponding to a shape of a first pad to be formed at a corresponding portion in a peripheral region around the electronic component mounting area;
forming a support base member having a recessed portion by removing a required amount of a portion of the support base material, the portion being exposed through the opening portion of the first resist layer;
forming, after removing the first resist layer, a second resist layer on a surface of the support base member where the recessed portion is formed, the second resist layer being patterned to have a first opening portion according to a shape of a second pad to be formed at the portion corresponding to the electronic component mounting area, and to have a second opening portion at a portion corresponding to the recessed portion;
forming a plurality of metal layers respectively on portions of the support base member and on an inner wall surface of the recessed portion in the support base member, the portions and the recessed portion being exposed through the first and second opening portions of the second resist layer;
forming, after removing the second resist layer, an insulating layer on a surface of the support base member where the metal layers are formed, in such a manner that a portion of each of the metal layers is exposed;
forming a wiring layer on the insulating layer, the wiring layer including vias connected to the metal layers, respectively;
and
alternately stacking a required number of insulating layers and wiring layers and removing the support base member.

6 more elements

A method of manufacturing a wiring board, comprising:

forming a first resist layer on a support base material,
the first resist layer being patterned to have an opening portion in a manner to leave a portion corresponding to an electronic component mounting area, the opening portion corresponding to a shape of a first pad to be formed at a corresponding portion in a peripheral region around the electronic component mounting area;
forming a support base member having a recessed portion by removing a required amount of a portion of the support base material, the portion being exposed through the opening portion of the first resist layer;
forming, after removing the first resist layer, a second resist layer on a surface of the support base member where the recessed portion is formed, the second resist layer being patterned to have opening portions at a portion corresponding to the recessed portion;
forming a plurality of metal layers on an inner wall surface of the recessed portion of the support base member exposed through the opening portion of the second resist layer;
forming, after removing the second resist layer, a third resist layer on a surface of the support base member where the metal layers are formed, the third resist layer being patterned to have an opening portion according to a shape of a second pad to be formed at a corresponding portion in the electronic component mounting area;
stacking a plurality of metal films constituting the second pad on the support base member exposed through the opening portion of the third resist layer;
forming, after removing the third resist layer, an insulating layer on a surface of the support base member where the metal layers are formed in such a manner that a portion of each of the metal layers is exposed;
forming a wiring layer on the insulating layer, the wiring layer including vias connected to the metal layers and the metal films, respectively;
and
alternately stacking a required number of insulating layers and wiring layers and removing the support base member.

8 more elements

Dependencies are inferred from the claim text.

Wiring board and method of manufacturing the same

Life of this patent

Wiring board and method of manufacturing the same

Life of this patent

Abstract

Claims10