Circuit substrate, circuit module and method for manufacturing the circuit substrate
AssigneeMurata Manufacturing Co., Ltd.
InventorYutaka FUKUDA
Life of this patent
Estimating the term…
Abstract
A thin circuit substrate and a circuit module are arranged such that the circuit module includes an IC mounted on a circuit substrate, the IC includes an IC body and an solder bump located on a mounting surface of the IC body, and the circuit substrate includes a substrate including a recess formed by recessing a portion of a mounting surface of the substrate on which the IC is to be mounted, and a terminal protruding from the mounting surface of the substrate. The terminal is to be electrically connected to the solder bump.
Claims12
A circuit substrate on which a first electronic component including a bump is to be mounted, the circuit substrate comprising:
- a substrate including a mounting surface on which the first electronic component is to be disposed, the mounting surface including a recess defined by a recessed portion of the mounting surface;
- and
- a terminal to be electrically connected to the bump of the first electronic component, the terminal protruding from the mounting surface within the recess.
A circuit module comprising:
- a first electronic component;
- and
- a circuit substrate on which the first electronic component is mounted;
- wherein
- the first electronic component includes an electronic component body and a bump on the electronic component body, and the circuit substrate includes a substrate including a mounting surface on which the first electronic component is disposed and including a recess defined by a recessed portion of the mounting surface, and a terminal protruding from the mounting surface within the recess and electrically connected to the bump.
A method for manufacturing a circuit substrate on which a first electronic component having a bump is to be mounted, the circuit substrate including a terminal to which the bump of the first electronic component is to be electrically connected, the method comprising the steps of:
- forming a mask layer on a portion of a main surface of a first sheet;
- forming a through-hole in the mask layer;
- filling the through-hole with a conductive material;
- stacking a plurality of second sheets and the first sheet having the mask layer such that the mask layer defines an uppermost layer, and compressing the stack to embed the mask layer in the first sheet;
- and
- removing the mask layer from the stack of the first sheet and the second sheets.
Dependencies are inferred from the claim text.