Circuit substrate and circuit substrate manufacturing method
AssigneeMurata Manufacturing Co., Ltd.
InventorYutaka FUKUDA
Life of this patent
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Abstract
A circuit substrate includes protruding terminals and has a structure that ensures an excellent connection with an electronic component, such as an IC. The circuit substrate on which an IC is to be mounted includes terminals that are to be electrically connected to solder bumps located on the IC. The terminals protrude from the mounting surface of a substrate body on which the IC is to be mounted. The sectional area of the top surface of each of the terminals is about 1.2 times the sectional area of each of the terminals on the mounting surface.
Claims11
A circuit substrate on which an electronic component is to be mounted, the circuit substrate comprising:
- a substrate body;
- and
- a terminal to be electrically connected to a bump on the electronic component, the terminal being arranged to protrude from a mounting surface of the substrate body on which the electronic component is to be mounted;
- wherein
- an area of a top surface of the terminal is about 1.2 times a sectional area of a section of the terminal at the mounting surface of the substrate body.
A circuit substrate on which an electronic component is to be mounted, the circuit substrate comprising:
- a substrate body;
- and
- a terminal to be electrically connected to a bump on the electronic component, the terminal being arranged to protrude from a mounting surface of the substrate body on which the electronic component is to be mounted;
- wherein
- a sectional area of a section of the terminal that is parallel or substantially parallel with the mounting surface increases from a section at the mounting surface to a top surface of the terminal;
- and
- a change rate of the sectional area of the terminal at an area of the top surface is larger than a change rate of the sectional area of the section of the terminal at the mounting surface.
A method for manufacturing a circuit substrate on which an electronic component is to be mounted, the circuit substrate including a terminal to be electrically connected to a bump on the electronic component, the method comprising the steps of:
- forming a mask layer on a first sheet, the mask layer being softer than the first sheet;
- making a through hole in the mask layer;
- filling the through hole with a conductor;
- obtaining a multilayer body by crimping a plurality of second sheets, the first sheet, and the mask layer onto one another in such a manner that the mask layer is the uppermost layer;
- and
- eliminating the mask layer from the multilayer body.
Dependencies are inferred from the claim text.