Composite multilayer wiring board
AssigneeNEC Corporation
InventorJunya Sato
Life of this patent
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Abstract
Electronic components on a printed wiring board can be protected from the impact force of a fall, whereby the electrical and mechanical reliability of the electronic apparatus components can be greatly improved, and moreover, smaller size, lighter weight, higher functionality, and greater multifunctionality can be achieved. The composite multilayer wiring board of the present invention includes a plurality of intermediate layers each interposed between a plurality of printed wiring boards, at least one of the plurality of intermediate layers being composed of a resin material having a dilatancy characteristic.
Claims10
A composite multilayer wiring board comprising:
- a plurality of printed wiring boards, and
- a plurality of intermediate layers each interposed between a plurality of said printed wiring boards;
- wherein at least one of said plurality of intermediate layers is composed of a resin material that has a dilatancy characteristic.
Dependencies are inferred from the claim text.