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US 2010/0147560 A1Published application
Wiring board and method of manufacturing the same
AssigneeShinko Electric Industries Co., Ltd.
InventorKentaro KANEKO
Life of this patent
Estimating the term…
Abstract
A wiring board (package) includes: a cavity formed at a position corresponding to a chip mounting area of the outermost insulating layer on one side of both surfaces of the wiring board; a pad exposed from the surface of the insulating layer in the cavity; and a pad exposed from the surface of the insulating layer in a peripheral region of the cavity. A chip is flip-chip bonded to the pads in the cavity of the package, and another package is bonded to the pads in the peripheral region of the cavity, to thereby form a semiconductor device having a package on package (POP) structure.
Claims5
A method of manufacturing a wiring board, comprising:
- forming a first resist layer on a support base material, the first resist layer being patterned to have only a portion corresponding to a position of a cavity to be formed;
- forming a support base member having a step portion by removing a required amount of the support base material with the first resist layer being used as a mask;
- forming a second resist layer on a surface of the support base member where the step portion is formed, after removing the first resist layer, the second resist layer being patterned to have first and second opening portions at positions on and outside the step portion, respectively;
- forming first and second pads on the support base member exposed from the first and second opening portions of the second resist layer, respectively;
- forming an insulating layer on the support base member after removing the second resist layer, the insulating layer covering the first and second pads;
- forming an opening portion through which a portion of each of the pads is exposed from a top surface of the insulating layer;
- forming a wiring layer on the insulating layer, the wiring layer including vias connected to the pads, respectively;
- and
- alternately stacking a required number of insulating layers and wiring layers and then removing the support base member.
6 more elements
A method of manufacturing a wiring board, comprising:
- forming a first resist layer on a support base material, the first resist layer being patterned to have an opening portion at a portion corresponding a position of a cavity to be formed;
- forming a support base member having a step portion by forming a sacrifice conductive layer with a required thickness on the support base material exposed from the opening portion of the first resist layer;
- forming a second resist layer on a surface of the support base member where the step portion is formed, after removing the first resist layer, the second resist layer being patterned to have a first opening portion at a position on the sacrifice conductive layer in an upper portion of the step portion, and to have a second opening portion at a position outside the step portion;
- forming first and second pads on the sacrifice conductive layer and the support base member exposed from the first and second opening portions of the second resist layer, respectively;
- forming an insulating layer on the sacrifice conductive layer and the support base member after removing the second resist layer, the insulating layer covering the first and second pads;
- forming an opening portion through which a portion of each of the pads is exposed from a top surface of the insulating layer;
- forming a wiring layer on the insulating layer, the wiring layer including vias connected to the pads, respectively;
- and
- alternately stacking a required number of insulating layers and wiring layers and then removing the support base member and the sacrifice conductive layer.
6 more elements
A wiring board comprising:
- an insulating layer which is positioned outermost on one side of surfaces of the wiring board, the insulating layer including a cavity at a position corresponding to an electronic component mounting area;
- a first pad exposed from a surface of the insulating layer in the cavity;
- and
- a second pad exposed from a surface of the insulating layer in a peripheral region of the cavity.
1 more element
A wiring board comprising:
- an insulating layer which is positioned outermost on one side of surfaces of the wiring board, the insulating layer including a cavity at a position corresponding to an electronic component mounting area;
- a first pad exposed in the cavity at a position recessed from a surface of the insulating layer to an inner side of the board;
- and
- a second pad exposed from a surface of the insulating layer in a peripheral region of the cavity.
1 more element
Dependencies are inferred from the claim text.