Carrier used in the manufacture of substrate and method of manufacturing substrate using the carrier
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsKi Hwan Kim, Jin Yong An, Myung Sam Kang
Life of this patent
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Abstract
The invention relates to a carrier used in the manufacture of a substrate and a method of manufacturing a substrate using the carrier, the method including (A) preparing a carrier comprising a releasing layer, and insulating layers and metal layers sequentially disposed on both sides of the releasing layer; (B) patterning the metal layers to form base circuit layers; (C) forming buildup layers on the base circuit layers; (D) executing a routing process to separate the insulating layers from the releasing layer; and (E) forming solder-resist layers on the buildup layers and forming openings in-the solder-resist layers and the insulating layers to expose pads.
Claims9
A carrier used in the manufacture of a substrate, comprising:
- a releasing layer;
- insulating layers disposed on both sides of the releasing layer;
- and
- metal layers disposed on the insulating layers.
A method of manufacturing a substrate using a carrier, comprising:
- preparing a carrier comprising a releasing layer, and insulating layers and metal layers sequentially disposed on both sides of the releasing layer;
- patterning the metal layers to form base circuit layers;
- forming buildup layers on the base circuit layers;
- executing a routing process to separate the insulating layers from the releasing layer;
- and
- forming solder resist layers on the buildup layers and forming openings in the solder resist layers and the insulating layers to expose pads.
Dependencies are inferred from the claim text.