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US 2010/0147523 A1Published application
System and method for downhole cooling of components utilizing endothermic decomposition
AssigneeBaker Hughes Incorporated
InventorRocco DiFoggio
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Abstract
A system for controlling a temperature of a downhole component is disclosed. The system includes: a cooling material in thermal communication with the downhole component; and a container configured to house the cooling material therein, the cooling material configured to undergo an endothermic reaction and decompose at a selected temperature and absorb heat from the downhole component.
Claims20
A system for controlling a temperature of a downhole component, the system comprising:
- a cooling material in thermal communication with the downhole component;
- and
- a container configured to house the cooling material therein, the cooling material configured to undergo an endothermic reaction and decompose at a selected temperature and absorb heat from the downhole component.
A method of controlling a temperature of a downhole component, the method comprising:
- disposing a cooling material in a container and in thermal communication with the downhole component;
- and
- disposing the downhole component in a borehole in an earth formation and exposing the cooling material to a selected temperature sufficient to cause the cooling material to undergo an endothermic reaction to decompose the cooling material at a selected temperature and absorb heat from the downhole component.
Dependencies are inferred from the claim text.