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US 2010/0147496 A1Published application
Heat dissipation device with heat pipe
AssigneesFu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
InventorPeng Liu
Life of this patent
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Abstract
A heat dissipation device includes a heat sink and a helical heat pipe assembly. The heat sink includes a hollow cylindrical body and a number of fins extending inwardly from an inner surface of the body to an axis of the body. The helical heat pipe assembly is wrapped on an outer surface of the body and helically extends along an axial direction of the body.
Claims17
A heat dissipation device comprising:
- a heat sink comprising a hollow cylindrical body and a plurality of fins extending inwardly from an inner surface of the body to an axis of the body;
- and
- a helical heat pipe assembly wrapped on an outer surface of the body and helically extending along the axial direction of the body.
A heat dissipation device comprising:
- a heat sink comprising a tubular, cylindrical body and a plurality of fins extending inwardly from an inner surface of the body to an axis of the body, the fins each having a free end unconnected to the inner surface of the body, the free ends of the fins cooperatively defining an aperture communicating with two side surfaces of the body;
- a plurality heat pipes disposed on an outer surface of the body and surrounding the outer surface of the body;
- a fan mounted to one of the two side surfaces of the body.
Dependencies are inferred from the claim text.