Heat-dissipating fin
AssigneeTai-Sol Electronics Co., Ltd.
InventorsYue-Ping Dai, Meng Hung Ko, Jun Chen
Life of this patent
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Abstract
A heat-dissipating fin includes a sheety main body. The main body is provided with a high-temperature area located at each of two sides thereof, an airflow area located at a midsection thereof for an external airflow to pass through, at least one guide wall formed at the airflow area and having a front end facing the main body, and two inclined guide portions each extending rearward toward one side thereof from a front end thereof. In this way, the external airflow can be guided to the high-temperature areas of the fin to reach greater heat-dissipating efficiency.
Claims10
A heat-dissipating fin comprising a sheety main body having two high-temperature areas, each of which is located at one of two sides thereof, said main body having an airflow area located at a midsection thereof for airflow to pass through, said main body having at least one guide wall located at said airflow area and having a front end facing a front side of said main body, said at least one guide wall having two inclined guide portions extending bilaterally rearward from the front end thereof.
Dependencies are inferred from the claim text.