Method of fabricating printhead assembly
AssigneeSilverbrook Research Pty Ltd
InventorsSeung Jin Lee, Susan Williams, Jan Waszczuk, Kia Silverbrook
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Abstract
A printhead assembly includes a molded ink manifold, a plurality of printhead integrated circuits, and an adhesive film sandwiched between the ink manifold and the printhead integrated circuits. A manifold bonding surface of the molded ink manifold includes a polymer coating. The polymer coating plugs fissures resulting from a molding process used to mold the ink manifold.
Claims12
A method of fabricating a printhead assembly, said method comprising the steps of:
- (i) providing a molded ink manifold having a manifold bonding surface for attachment of one or more printhead integrated circuits, said bonding surface having a plurality of ink outlets defined therein, said bonding surface having a plurality of fissures resulting from a molding process;
- (ii) coating at least said manifold bonding surface with a polymer coating, thereby plugging said fissures;
- and
- (iii) bonding one or more printhead integrated circuits to said manifold bonding surface.
A bonded printhead assembly comprising one or more printhead integrated circuits bonded to manifold bonding surface of a molded ink supply manifold, wherein said manifold bonding surface comprises a polymer coating, said polymer coating plugging a plurality of fissures in said molded ink manifold.
Dependencies are inferred from the claim text.