Method of mounting electronic circuit constituting member and relevant mounting apparatus
AssigneePanasonic Corporation
InventorsTohru NAKAGAWA, Hideo TORII
Life of this patent
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Abstract
A mounting method comprising the steps of (A) disposing first liquid (2) on first region (11) provided on one principal surface of substrate (1); (B) bringing member-containing liquid (5) containing second liquid (3) and at least one member (4) into contact with the first liquid (2) disposed on the first region (11); and (C) removing the first liquid (2) and the second liquid (3) from the one principal surface to thereby dispose the member (4) on the first region (11). The first liquid (2) is substantially not dissolved in the second liquid (3). The wettability of the first liquid (2) with respect to the surface of the member (4) is higher than that of the second liquid (3).
Claims11
-15. (canceled)
A method for mounting an electronic circuit-constituting member on a substrate, comprising the steps of:
- (A) preparing a substrate comprising a liquid-attracting first region and a liquid-repelling second region;
- wherein said second region surrounds said first region;
- (B) bringing water into contact with the surface of the substrate to dispose said water only on the said first region;
- (C) subjecting said substrate to a member-containing liquid where an electronic circuit-constituting member are dispersed in a organic solvent to move said electronic circuit-constituting member to said water disposed on the said first region;
- the surface of the member being chemically modified with a silane coupling agent including a group with a C—Cl bond, and
- (D) removing said water and said organic solvent from said the surface of the substrate to mount said electronic circuit-constituting member on said substrate.
Dependencies are inferred from the claim text.