Method of transferring elements, element disposition substrate, device and method of manufacturing the same

A method of manufacturing a device, comprising the steps of:

• holding a plurality of elements made at a first pitch on an element formation substrate on a temporarily holding substrate in a lamp state in which the first pitch is held although said plurality of elements are partitioned into pieces;
• forming a plurality of element mounting bases each having a planer shape having a size smaller than the first pitch, and each having a bearing surface slightly higher than a surface of a main portion of an element disposition substrate in its periphery at a second pitch equal to an integral multiple of the first pitch on the surface of said main portion of said element disposition substrate, obtaining an element disposition substrate;
• disposing an uncured adhesive agent layer on each of said bearing surfaces of said element mounting bases;
• making said temporarily holding substrate and said element disposition substrate close to each other in a state in which principal surfaces of said temporarily holding substrate and said element disposition substrate face each other, and causing partial elements of said plurality of elements to come in contact with said uncured adhesive agent layer;
• curing said uncured adhesive agent layer, fixing the partial elements contacting said adhesive agent layer to said element mounting bases, respectively;
• separating said temporarily holding substrate and said element disposition substrate from each other with the partial elements contacting said adhesive agent layer being left on the respective element mounting bases;
• and
• cutting and partitioning said element disposition substrate into pieces each having a predetermined shape, and/or connecting the plurality sheet of element disposition substrates to one another, forming a substrate having the elements each having the predetermined shape through assemble.