Dynamic Film Thickness Control System/Method and its Utilization
OwnerKow-Je LING, Jiunn-Shiuh Juanginventors
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Abstract
A dynamic film thickness control system/method and its utilization consisting of a minimum of one mask plate arranged between a substrate and a vapor source. A film thickness control device is utilized for real-time control over deposited film thickness and gradually moves the mask plate according to the film thickness control value acquired by the film thickness control device, enabling the mask plate to mask film zones on the said substrate to achieve the film thickness of a design objective. When the required zones of deposition are masked, the deposition of a particular film layer is completed.
Claims5
A dynamic film thickness control system comprising a mask plate and a film thickness control device;
- the mask plate being situated between a substrate and a vapor source and the film thickness control device being placed at an appropriate position;
- the utilization of the film thickness control device providing for real-time control over a coated film thickness and gradually moves the mask plate according to a film thickness control value acquired by the film thickness control device, enabling the mask plate to mask film zones on the substrate to achieve the film thickness of a design objective, wherein the film thickness control device comprises a quartz crystal attached to an end section at a lower extent to the mask plate.
Dependencies are inferred from the claim text.