Back to results
US 2010/0147203 A1Published application
Three-dimensional Wiping Substrate And Method Therefor
AssigneeKimberly-Clark Worldwide, Inc.
InventorsJohn Gavin MacDonald, Jaeho Kim, WanDuk Lee, Jin Heo, CholWon Koh, SangSoo Lee
Life of this patent
Estimating the term…
Abstract
A planar substrate has a moisture activated shrinking filament applied thereon. When wetted, the shrinking filament shrinks and causes the planar substrate to gather and pucker. The planar substrate with the filament thereon may be compressed into a compact shape when in a dry state.
Claims15
A method of making an article comprising the steps of:
- providing a planar substrate;
- stitching the planar substrate with a moisture sensitive shrinking filament;
- wherein the stitching forms a pattern, and wherein the stitching is not displaced with respect to the planar substrate.
A method of creating a three-dimensional article comprising the steps of:
- (a) providing a planar substrate;
- (b) stitching the planar substrate with a moisture sensitive shrinking filament;
- wherein the stitching forms a pattern, and wherein the stitching is not displaced with respect to the planar substrate;
- (c) compressing the planar substrate into a pill configuration;
- and
- (d) applying an aqueous liquid to the planar substrate.
3 more elements
Dependencies are inferred from the claim text.