Mems devices and methods with controlled die bonding areas
AssigneeHoneywell International Inc.
InventorsGalen Magendanz, Mark Eskridge, Matt Loesch
Life of this patent
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Abstract
Microelectromechanical system (MEMS) devices and methods with controlled die bonding areas. An example device includes a MEMS die having a glass layer and a protective package. The glass layer includes a side facing the protective package with at least one mesa protruding from a recessed portion of the glass layer. The at least one mesa is attached to the protective package. An example method includes creating at least one mesa on a glass layer of a MEMS die and attaching the at least one mesa to a protective package.
Claims18
A microelectromechanical (MEMS) device comprising:
- a MEMS die having a glass layer;
- and
- a protective package,
- wherein the glass layer includes a side facing the protective package, the side including at least one mesa protruding from a recessed portion of the glass layer, and wherein the at least one mesa is attached to the protective package.
A method of reducing thermal stress in a packaged MEMS device, the method comprising:
- creating at least one mesa on a layer of a MEMS die;
- and
- attaching the at least one mesa to a protective package.
Dependencies are inferred from the claim text.