Method in manufacturing of circuit boards
AssigneeFinnish Environment Technology Oy
InventorsAntti Salminen, Rauno Holappa
Life of this patent
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Abstract
Method for connecting the conductive surfaces of circuit boards, especially a circuit board equipped with at least two conductive surfaces separated by an insulator layer and with holes, or for creating conductors on a board in a manner that conducts electricity. In the method, a metal or metal alloy, in a powder form, is fed into and the powder is sintered using a laser in order to create a unified conductive structure.
Claims7
Method for forming the conductive parts of circuit boards, especially a circuit board equipped with two conductive surfaces, separated by an insulator layer, and with holes, in a manner that conducts electricity, comprising:
- providing a metal or metal alloy, in a powder form, that is fed into the holes connecting the surfaces, or on top of the insulator layer of the circuit board, wherein the powder is sintered using a laser in order to create a unified conductive structure, and, if necessary, the addition and sintering of the powder is repeated a sufficient number of times to achieve the a desired electrical conductivity.
Dependencies are inferred from the claim text.