Production method for electronic chip component

A production method for an electronic chip component including an electronic component body including first and second functional members formed of paste, first and second main surfaces, first and second side surfaces arranged perpendicular or substantially perpendicular to the first and second main surfaces, and first and second end surfaces arranged perpendicular or substantially perpendicular to the first and second main surfaces and the first and second side surfaces, the first and second functional members being respectively provided on the first and second end surfaces of the electronic component body, the production method comprising:

• a sticking step of sticking the second end surface of the electronic component body onto a substrate having an adhesive surface;
• a step of forming a first paste layer by applying the paste onto the first end surface of the electronic component body stuck to the substrate and drying the paste;
• a step of turning the electronic component body 180 degrees so as to stick the first end surface of the electronic component body with the first paste layer onto the substrate by sliding a slider relative to the substrate in a state in which the slider is in contact with the first end surface of the electronic component body;
• a step of forming a second paste layer by applying the paste onto the second end surface of the electronic component body and drying the paste;
• and
• a step of forming the first and second functional members by firing the first and second paste layers.