Acoustic wave device and method for fabricating the same
AssigneeMurata Manufacturing Co., Ltd.
InventorsShunsuke KIDO, Takeshi NAKAO, Yasuharu NAKAI, Kenji NISHIYAMA, Michio KADOTA
Life of this patent
Estimating the term…
Loading patent…
AssigneeMurata Manufacturing Co., Ltd.
InventorsShunsuke KIDO, Takeshi NAKAO, Yasuharu NAKAI, Kenji NISHIYAMA, Michio KADOTA
Estimating the term…
A surface acoustic wave device includes a piezoelectric substrate, at least one interdigital transducer (IDT) electrode provided on the piezoelectric substrate, and an insulator layer to improve a temperature characteristic arranged so as to cover the IDT electrode. When a surface of the insulator layer is classified into a first surface region under which the IDT electrode is positioned and a second surface region under which no IDT electrode is positioned, the surface of the insulator layer in at least one portion of the second surface region is higher than the surface of the insulator layer from the piezoelectric substrate in at least one portion of the first surface region by at least about 0.001λ, where the wavelength of an acoustic wave is λ.
A method for fabricating an acoustic wave device, the method comprising the steps of:
Dependencies are inferred from the claim text.