Electrical connector system

A wafer assembly, comprising:

• a housing defining a plurality of electrical contact channels and a plurality of projections extending from an edge of the housing at a mounting end of the wafer assembly;
• and
• an array of electrical contacts positioned substantially within the plurality of electrical contact channels, each electrical contact of the array of electrical contacts defining a signal substrate engagement element extending past the edge of the housing at the mounting end of the wafer assembly;
• wherein at least a portion of a first projection of the plurality of projections is dimensioned to fit into a corresponding hole in a substrate when the housing is engaged with the substrate, and wherein the first projection is positioned on the housing to block a line-of-sight between a first signal substrate engagement element of the array of electrical contacts and a second signal substrate engagement element of the array of electrical contacts.

An electrical connector system, comprising:

• a plurality of wafer assemblies, each wafer assembly comprising:
• a first housing defining a plurality of first electrical contact channels, the first housing defining a plurality of projections extending from an edge of the first housing at a mounting end of the wafer assembly;
• a first array of electrical contacts positioned substantially within the plurality of first electrical contact channels, each electrical contact of the first array of electrical contacts defining a signal substrate engagement element extending past the edge of the first housing at the mounting end of the wafer assembly;
• a second housing configured to mate with the first housing, the second housing defining a plurality of second electrical contact channels, the second housing defining a plurality of projections extending from an edge of the second housing at the mounting end of the wafer assembly;
• and
• a second array of electrical contacts positioned substantially within the plurality of second electrical contact channels, each electrical contact of the second array of electrical contacts defining a signal substrate engagement element extending past an edge of the second housing at the mounting end of the wafer assembly;
• and
• an organizer positioned at the mounting end of the plurality of wafer assemblies, wherein the organizer defines:
• a first plurality of apertures dimensioned to allow the signal substrate engagement elements of the first and second arrays of electrical contacts to pass through the organizer and extend away from the organizer;
• and
• a second plurality of apertures dimensioned to allow the projections extending from the first and second housings to pass through the organizer;
• and
• wherein the plurality of projections of the first housing and the plurality of projections of the second housing are dimensioned to pass through the second plurality of apertures of the organizer and into corresponding holes in a substrate when the first housing and the second housing are engaged with the substrate.