US 2010/0144203 A1 · ELECTRICAL CONNECTOR SYSTEM

Abstract

High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.

Claims17

Dependent claims

An electrical connector system for mounting a substrate, the system comprising:

a plurality of wafer assemblies, each wafer assembly comprising:
a plurality of electrical contacts;
a frame defining a first side and a second side, the first side defining a plurality of channels, each channel comprising a conductive surface and each channel adapted to receive at least one electrical contact of the plurality of electrical contacts;
wherein the frame further defines a plurality of apertures extending into the conductive surfaces of the plurality of channels, the apertures spaced apart from one another and positioned between the channels of the plurality of channels;
and
a plurality of ground-able contacts, each ground-able contact positioned within an aperture of the plurality of apertures;
and
a wafer housing to position the wafer assemblies adjacent to one another in the electrical connector system.

5 more elements

Dependencies are inferred from the claim text.

Electrical connector system

Life of this patent

Electrical connector system

Life of this patent

Abstract

Claims17