Electrical connector system
AssigneeTyco Electronics Corporation
InventorsDouglas W. Glover, David W. Helster, Timothy R. Minnick, Chad W. Morgan, Evan C. Wickes
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AssigneeTyco Electronics Corporation
InventorsDouglas W. Glover, David W. Helster, Timothy R. Minnick, Chad W. Morgan, Evan C. Wickes
Estimating the term…
High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.
A substrate configured to receive an electrical component, the substrate comprising:
A header assembly for mounting an electrical connector to a substrate, the header assembly comprising:
A plurality of wafer assemblies configured to mount to a substrate, the plurality of wafer assemblies comprising:
A substrate configured to receive an electrical component, the substrate comprising:
Dependencies are inferred from the claim text.