Electrical Connector System
AssigneeTyco Electronics Corporation
InventorsDouglas W. Glover, David W. Helster, Timothy R. Minnick, Chad W. Morgan, Evan C. Wickes
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AssigneeTyco Electronics Corporation
InventorsDouglas W. Glover, David W. Helster, Timothy R. Minnick, Chad W. Morgan, Evan C. Wickes
Estimating the term…
High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.
A header module for an electrical connector system that is adapted to mate with a wafer housing and a plurality of wafer assemblies, the header module comprising:
A header module for an electrical connector system that is adapted to mate with a wafer housing and a plurality of wafer assemblies, the header module comprising:
A header module for an electrical connector system that is adapted to mate with a wafer housing and a plurality of wafer assemblies, the header module comprising:
Dependencies are inferred from the claim text.