Method to integrate micro electro mechanical system and cmos image sensor
OwnerHui-Shen Shihinventor
Life of this patent
Estimating the term…
Abstract
A method to integrate a micro electro mechanical system and a CMOS image sensor is disclosed. First a substrate is provided. The substrate includes a micro electro mechanical system (MEMS) region and a CMOS image sensor (CIS) region. The micro electro mechanical system region includes a micro electro mechanical system component and the CMOS image sensor region includes a CMOS image sensor element. Second, an etching procedure is performed on the substrate to form a micro electro mechanical system trench and a CMOS image sensor trench. The etching procedure includes at least a dry etching and at least a wet etching.
Claims13
A method to integrate a micro electro mechanical system and an image sensor, comprising:
- providing a substrate comprising a micro electro mechanical system (MEMS) region and an image sensor region, said micro electro mechanical system region comprising a micro electro mechanical system component and said image sensor region comprising an image sensor element;
- and
- performing an etching procedure on said substrate to form a micro electro mechanical system trench in said micro electro mechanical system region and an image sensor trench in said image sensor region, said etching procedure comprising carrying out at least a dry etching and at least a wet etching.
Dependencies are inferred from the claim text.