Method of manufacturing semiconductor package

A method of manufacturing a semiconductor package comprising:

• preparing a different bonded panel including first and second stacked metal layers;
• forming a pad unit by etching the second metal layer;
• mounting a semiconductor chip to be connected to the pad unit;
• sealing the semiconductor chip;
• forming a rearrangement wiring layer by etching the first metal layer;
• and
• forming an external connection unit electrically connected to the rearrangement wiring layer.

A method of manufacturing a semiconductor package comprising:

• preparing a different bonded panel including stacked metal layer and wafer substrate;
• forming a pad unit on the metal layer;
• mounting a semiconductor chip to be connected to the pad unit;
• sealing the semiconductor chip;
• removing the wafer substrate;
• forming a rearrangement wiring layer by etching the metal layer;
• and
• forming an external connection unit electrically connected to the rearrangement wiring layer.