Substrate processing apparatus and method of manufacturing semiconductor device
AssigneeHitachi Kokusai Electric Inc.
InventorsSatoru TAKAHATA, Yukio OZAKI, Reizo NUNOZAWA
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AssigneeHitachi Kokusai Electric Inc.
InventorsSatoru TAKAHATA, Yukio OZAKI, Reizo NUNOZAWA
Estimating the term…
When a step is delayed, an operator can be rapidly informed of the delay. A substrate processing apparatus comprises a process system configured to process a substrate, a control unit configured to control the process system for performing a plurality of steps, and a manipulation unit configured to monitor progresses of the steps. While the control unit waits for completion of a predetermined one of the steps after the control unit controls the process system to start the predetermined step, if a time elapsing from the start of the predetermined step exceeds an allowable time previously allocated to each of the steps, the control unit transmits an alarm message to the manipulation unit so as to report that the allowable time is exceeded.
A substrate processing apparatus comprising:
A substrate processing apparatus comprising a control unit configured to perform a recipe comprising a plurality of steps,
A substrate processing apparatus comprising a manipulation unit configured to display a plurality of steps, in which substrate processing conditions are set in a time-series manner, on a manipulation screen, and to prepare or edit a recipe on the manipulation screen,
A method of manufacturing a semiconductor device by performing a recipe constituted by a plurality of steps, the method comprising:
Dependencies are inferred from the claim text.