Methods For Fabricating Semiconductor Components With Conductive Interconnects Having Planar Surfaces
AssigneeMicron Technology, Inc.
InventorsAlan G. Wood, William M. Hiatt, David R. Hembree
Life of this patent
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Abstract
A backside method for fabricating a semiconductor component with a conductive interconnect includes the step of providing a semiconductor substrate having a circuit side, a backside, and a substrate contact on the circuit side. The method also includes the steps of forming a substrate opening from the backside to the substrate contact, and then bonding the conductive interconnect to an inner surface of the substrate contact.
Claims25
A method for fabricating a semiconductor component comprising:
- providing a substrate having a first side, a second side, and a substrate contact on the first side;
- thinning and planarizing the substrate from the second side;
- forming an opening from the second side to an inner surface of the substrate contact;
- depositing a metal in the opening and bonding the metal to the inner surface;
- and
- planarizing the metal from the second side to a surface substantially co-planar with the second side.
A method for fabricating a semiconductor component comprising:
- providing a semiconductor substrate having a circuit side, a backside, and a substrate contact on the circuit side;
- forming an opening from the backside to an inner surface of the substrate contact;
- and
- forming a conductive interconnect comprising a metal ball contained in the opening having a bonded connection with the inner surface of the substrate contact and a height on the inner surface substantially equal to a depth of the opening.
A method for fabricating a semiconductor component comprising:
- providing a semiconductor substrate having a first side, a second side and a contact on the first side having an inner surface;
- forming a substrate opening in the semiconductor substrate from the second side to the inner surface of the contact;
- bonding a first end of a wire to the inner surface;
- severing the wire;
- depositing a dielectric material on the second side and in the substrate opening at least partially encapsulating the wire;
- and
- planarizing the dielectric material and a second end of the wire.
A method for fabricating a semiconductor component comprising:
- providing a semiconductor substrate having a first side, a second side and a substrate contact on the first side;
- forming a substrate opening in the substrate extending from the second side to the substrate contact;
- forming a dielectric material in the substrate opening having a planar portion proximate to the second side;
- and
- forming a conductive interconnect on the substrate contact comprising a wire in the substrate opening embedded in the dielectric material having a first end bonded to the substrate contact and a second end proximate to the planar portion of the dielectric material.
Dependencies are inferred from the claim text.