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US 2010/0144136 A1Published application
Semiconductor device with solder balls having high reliability
AssigneeNEC Electronics Corporation
InventorFumiyoshi KAWASHIRO
Life of this patent
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Abstract
A semiconductor device includes a substrate, a metal layer, an alloy layer and a Sn—Ag—Cu-based solder ball. The metal layer is configured to be formed on the substrate. The alloy layer is configured to be formed on the metal layer. The Sn—Ag—Cu-based solder ball is configured to be placed on the alloy layer. The alloy layer includes Ni and Zn as essential elements.
Claims6
A method of manufacturing a semiconductor device comprising:
- (a) forming a solder resist having an opening on a substrate;
- (b) forming a Ni inclusion plating layer inside said opening;
- and
- (c) installing a Sn—Ag—Cu-based solder ball through an alloy layer, which includes Ni and Zn as essential elements, on said Ni inclusion plating layer.
1 more element
Dependencies are inferred from the claim text.