Method of Forming Quad Flat Package

A method of making a semiconductor device, comprising:

• forming a leadframe having a surface and first and second level downset lead extensions, the first level downset lead extension having a surface offset from the surface of the leadframe, the second level downset lead extension having a surface offset from the surface of the first level downset lead extension;
• mounting a first semiconductor die or package to the surface of the second level downset lead extension;
• and
• mounting a second semiconductor die or package to the surface of the first level downset lead extension.

A method of making a semiconductor device, comprising:

• forming a leadframe having a surface and first level downset lead extensions, the first level downset lead extension having a surface offset from the surface of the leadframe;
• mounting a first semiconductor die or package to the surface of the first level downset lead extension;
• and
• mounting a second semiconductor die or package to the first semiconductor die or package.

A method of making a semiconductor device, comprising:

• forming a leadframe having a surface and first and second level downset lead extensions, the first level downset lead extension having a surface offset from the surface of the leadframe, the second level downset lead extension having a surface offset from the surface of the first level downset lead extension;
• mounting a first leadless semiconductor die to the surface of the second level downset lead extension;
• and
• mounting a second leadless semiconductor die to the surface of the first level downset lead extension.