Method for manufacturing passive device and semiconductor package using thin metal piece

A method for manufacturing passive devices in an integration mariner using a thin metal piece, the method comprising the steps of:

• forming an adhesive layer on a dummy substrate;
• bonding a thin metal piece on the adhesive layer;
• attaching a masking material on a backside of the thin metal piece, patterning regions where the passive devices are to be formed, and forming insulators at a predetermined depth in a predetermined regions of the thin metal piece;
• removing the masking material, forming metal pads on the backside of the thin metal piece using photolithograph;
• attaching the formed device to a lower substrate, using the metal pads;
• removing the adhesive layer and the dummy substrate;
• removing metal of an upper surface of the thin metal piece until the insulators are exposed;
• and
• forming solder bumps for surface-mounting to other substrate like PCB.