Light-Emitting Diode Arrays and Methods of Manufacture

A method for manufacturing an LED array, comprising:

• providing a base substrate (BS);
• providing on the base substrate a plurality of light emitting diodes, each light emitting diode comprising a stack of a first contact layer, a semiconductor stack and a second contact layer, the semiconductor stack being on top of the first contact layer, the second contact layer being on top of the semiconductor stack;
• arranging the plurality of light emitting diodes in a pixel matrix on the base substrate as LEDs of at least three types (R, G, B);
• arranging the LEDs according to their type (R, G, B) as at least a first, second and third sub-pixel in the pixel matrix for emission of radiation of a respective specific at least first, second and third color;
• providing precursor/adhesion layers on the base substrate, wherein light emitting diodes of at least one type of the at least three types of LEDs are directly on the base substrate, and light emitting diodes of other type(s) of the at least three types of LEDs are arranged on the precursor/adhesion layers respectively;
• providing interconnection circuitry on the substrate for connection to the light emitting diodes of the array for addressing each of the light emitting diodes;
• and
• providing an overcoat layer covering the plurality of light emitting diodes and filling gaps between the plurality of light emitting diodes.