High Throughput Die-to-Wafer Bonding Using Pre-Alignment

A method of forming integrated circuits, the method comprising:

• providing a bottom wafer comprising bottom dies;
• placing top dies into die holders of a die tray;
• placing the die tray adjacent to the bottom wafer, with an X-axis of the die tray being parallel to an X-axis of the bottom wafer;
• picking up and aligning a first top die to a first bottom die in the bottom wafer;
• recording coordinates of the first top die;
• bonding the first top die onto the first bottom die;
• calculating a position of a second top die to be moved according to the coordinates, wherein the position of the second top die corresponds to a second bottom die in the bottom wafer;
• and
• bonding the second top die to the second bottom die without an action for aligning the second top die to the second bottom die.

A method of forming integrated circuits, the method comprising:

• placing top dies comprising a first top die and a second top die into die holders of a die tray;
• placing the die tray adjacent to a bottom wafer, with an X-axis of the die tray being parallel to an X-axis of the bottom wafer;
• determining a relative x-coordinate and a relative y-coordinate of a second bottom die in the bottom wafer relative to a first bottom die in the bottom wafer;
• picking up and aligning the first top die with the first bottom die in the bottom wafer;
• recording a first x-coordinate and a first y-coordinate of the first top die after the first top die is aligned with the first bottom die;
• bonding the first top die onto the first bottom die;
• calculating a second x-coordinate by adding the first x-coordinate and the relative x-coordinate, and a second y-coordinate by adding the first y-coordinate and the relative y-coordinate;
• moving the second top die from the die tray to a second position corresponding to the second x-coordinate and the second y-coordinate;
• and
• bonding the second top die onto the second bottom die.