Process for producing photosensitive resin plate and relief printing plate having recessed and projected pattern, and plate surface treating liquid used in the process

A process for producing a relief printing plate comprising the steps of exposing, developing and post-treating, wherein

• the post-treatment step is treatment selected from the group consisting of heat treatment, post-exposure treatment with an active light source, and electron beam treatment,
• further comprising making a solution containing an ink-repellent component (A) and a curing component (B) attach to the plate surface of the relief printing plate prior to the post-treatment step or during the post-treatment step, wherein
• the ink-repellent component (A) comprising at least one compound selected from the group consisting of silicon-based compounds, fluorine-based compounds and paraffin-based compounds.

A treatment liquid for use in a plate surface of a photosensitive resin plate or a relief printing plate having a recessed and projected pattern, which comprises an ink-repellent component (A) and a curing component (B), wherein

• the ink-repellent component (A) comprises at least one compound selected from the group consisting of silicon-based compounds, fluorine-based compounds and paraffin-based compounds.

A use of an ink-repellent component (A) and a curing component (B) for producing a treatment liquid for reducing an ink blemish on a plate surface of a photosensitive resin plate or a relief printing plate having a recessed and projected pattern, wherein

• the ink-repellent component (A) comprises at least one compound selected from the group consisting of silicon-based compounds, fluorine-based compounds and paraffin-based compounds.