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US 2010/0143673 A1Published application
Photosensitive adhesive composition, film-like adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device and semiconductor device manufacturing method
OwnerKazuyuki Mitsukura, Takashi Kawamori +2inventors
InventorsKazuyuki Mitsukura, Takashi Kawamori, Takashi Masuko, Shigeki Katogi
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Abstract
The photosensitive adhesive composition of the invention comprises (A) an alkali-soluble resin, (B) an epoxy resin, (C) a radiation-polymerizable compound and (D) a photoinitiator, wherein the (D) photoinitiator contains at least (D1) a photoinitiator that exhibits a function which promotes polymerization and/or curing reaction of the epoxy resin by exposure to radiation.
Claims18
A photosensitive adhesive composition comprising
- (A) an alkali-soluble resin,
- (B) an epoxy resin,
- (C) a radiation-polymerizable compound and
- (D) a photoinitiator,
- wherein the (D) photoinitiator contains at least (D1) a photoinitiator that exhibits a function which promotes polymerization and/or curing reaction of the epoxy resin by exposure to radiation.
2 more elements
Dependencies are inferred from the claim text.