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US 2010/0142174 A1Published application
Integrated circuit packaging system and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsReza Argenty Pagaila, Byung Tai Do, Linda Pei Ee Chua
Life of this patent
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Abstract
A method of manufacture of an integrated circuit packaging system includes providing an integrated circuit having an active side and a non-active side; forming an indent, having a flange and an indent side, from a peripheral region of the active side; and forming a conformal interconnect, having an elevated segment, a slope segment, and a flange segment, over the indent.
Claims20
A method of manufacture of an integrated circuit packaging system comprising:
- providing an integrated circuit having an active side and a non-active side;
- forming an indent, having a flange and an indent side, from a peripheral region of the active side;
- and
- forming a conformal interconnect, having an elevated segment, a sloped segment and a flange segment, over the indent.
1 more element
A method of manufacture of an integrated circuit packaging system comprising:
- providing an integrated circuit having an active side and a non-active side with a terminal pad at the active side;
- forming an indent, having a flange and an indent side, from a peripheral region of the active side;
- and
- forming a conformal interconnect, having an elevated segment, a sloped segment and a flange segment, over the indent with the elevated segment over the terminal pad and with the sloped segment between the flange segment and the elevated segment.
1 more element
An integrated circuit packaging system comprising:
- an integrated circuit, having an active side and a non-active side, with an indent, having a flange and an indent side, in a peripheral region of the active side;
- and
- a conformal interconnect, having an elevated segment, a sloped segment, and a flange segment, over the indent.
Dependencies are inferred from the claim text.