Preferentially Cooled Electronic Device
AssigneeLSI Corporation
InventorAtila Mertol
Life of this patent
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Abstract
Various apparatuses and methods for a preferentially cooled electronic device are disclosed herein. For example, some embodiments provide an electronic apparatus including a package substrate and with a semiconductor die electrically and thermally connected to the package substrate by a plurality of connection nodes. At least one thermal trace interconnects at least one subset of the plurality of connection nodes. At least one heat dissipation trace on the package substrate is connected to the at least one subset of the plurality of connection nodes.
Claims22
An electronic apparatus comprising:
- a package substrate;
- a semiconductor die including a plurality of cores;
- at least one thermal trace interconnecting at least one subset of a plurality of connection nodes thermally connecting the semiconductor die to the package substrate;
- and
- at least one heat dissipation trace on the package substrate connected to the at least one subset of the plurality of connection nodes, wherein less than all of the plurality of cores are connected to any heat dissipation trace on the package substrate.
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A method of producing an electronic device, the method comprising:
- providing a package substrate including an inner conductive layer;
- connecting a semiconductor die to the a package substrate through a plurality of solder bumps;
- interconnecting at least one group of ground bumps in the plurality of solder bumps with thermal traces, and wherein at least one of the thermal traces extends across the inner conductive layer;
- connecting at least one heat dissipation trace on the package substrate to the at least one interconnected group of ground bumps;
- and
- connecting a heat spreader to the package substrate.
A preferentially cooled electronic device comprising:
- a package substrate;
- a semiconductor die comprising a plurality of cores, the semiconductor die being thermally connected to the package substrate by a plurality of solder bumps;
- at least one thermal trace interconnecting at least some ground bumps in the plurality of solder bumps adjacent each of the plurality of cores, wherein the thermal trace is non-uniformly distributed to provide preferential cooling to one of the plurality of cores in comparison to another of the plurality of cores;
- at least one heat dissipation trace on the package substrate connected to each of the interconnected ground bumps;
- a via connecting each said at least one heat dissipation trace to a ground plane in the package substrate;
- a heat spreader connected to the package substrate, wherein the at least one thermal trace is connected to the heat spreader;
- a heat sink connected to the heat spreader;
- and
- a printed circuit board connected to the package substrate by a plurality of solder balls.
Dependencies are inferred from the claim text.