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US 2010/0142142 A1Published application
Method and device for cooling heat-generating computer components
AssigneeSinitec Vertriebsgesellschaft Mbh
InventorMichael Riebel
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AssigneeSinitec Vertriebsgesellschaft Mbh
InventorMichael Riebel
Estimating the term…
The invention relates to a cooling arrangement with a first and at least one second heat-creating computer component, each coupled to at least one heatsink (40, 50). Heatsinks (40, 50) are arranged one after the other in a plane (10) in the direction of a provided coolant air stream (30). The cooling arrangement is distinguished in that heatsinks (40, 50) are of identical construction, and each heatsink (40, 50) comprises at least two side-by-side areas (41, 42, 51, 52) with heat transfer properties different from one another. In addition, heatsinks (40, 50) are arranged in plane (10) rotated relative to one another in such a manner that areas (42, 52) of heatsinks (40, 50) with a higher respective heat transfer power than the adjacent area (41, 51) are arranged one after the other in the direction of coolant air stream (30).
Cooling arrangement with a first and at least one second heat-generating computer component, each coupled to at least one heatsink (40, 50), wherein the heatsinks (40, 50) are arranged one after the other in a plane (10) in the direction of a provided coolant air stream (30), characterized in that the heatsinks (40, 50) are of identical construction, and each heatsink (40, 50) comprises at least two side-by-side areas (41, 42, 51, 52) with heat transfer properties different from one another, and the heatsinks (40, 50) are arranged rotated or offset relative to one another in the plane (10) such a manner that one of the areas (51, 52) of the downstream heatsink is downstream in the direction of the coolant air stream (30) essentially only of the area (42) of the upstream heatsink (40) with the worse heat transfer properties.
Method with a first and at least one second heat-generating computer component, each of which is coupled to a heatsink (40, 50), wherein a coolant airstream (30) is provided that cools first and second heatsinks (40, 50), and wherein the heatsinks (40, 50) are arranged one after the other in the direction of coolant air stream (30) in a plane (10) in the direction of a provided coolant air strewn (30), characterized in that the two heatsinks (40, 50) are of identical construction, and each comprises side-by-side areas (41, 42, 51, 52) with heat transfer properties different from one another and arranged one after the other in such a manner that, in the flow direction of the coolant air stream (30), one area (51, 52) of downstream heatsink (50) is downstream in the direction of the coolant air stream (30) only of the area (41) of upstream heatsink (40) with the worse heat transfer property.
Cooling arrangement with a first and at least one second heat-generating computer component, each coupled to at least one heatsink (40, 50), wherein the heatsinks (40, 50) are arranged one after the other in a plane (10) in the direction of a provided coolant air stream (30), characterized in that the heatsinks (40, 50) are of identical construction and each heatsink (40, 50) comprises at least two side-by-side areas, (41, 42, 51, 52) with flow resistances different from one another, and the heatsinks (40, 50) are arranged rotated or offset relative to one another in such a manner that, one of the areas (51, 52) of the downstream heatsink is downstream in the direction of the coolant air stream (30) essentially only of the area (42) of the upstream heatsink (40) with the lower flow resistances.
Dependencies are inferred from the claim text.