Suspension substrate, suspension, head suspension and hard disk drive
AssigneeDai Nippon Printing Co., Ltd.
InventorShigeki KAWANO
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AssigneeDai Nippon Printing Co., Ltd.
InventorShigeki KAWANO
Estimating the term…
It is a primary object of the present invention to provide a suspension substrate having reduced strain. The present invention solves the problem by providing a suspension substrate comprising: a fundamental structure in which a metal substrate, a first insulation layer, and a wiring are laminated in this order; a wide wiring laminate structure provided with a wide wiring first insulation part of the first insulation layer, a first wide wiring formed on the wide wiring first insulation part, a second insulation part formed on the first wide wiring, and a second wide wiring formed on the second insulation part; and a narrow wiring-containing structure provided with a narrow wiring first insulation part of the first insulation layer and a first narrow wiring formed on the narrow wiring first insulation part, wherein the narrow wiring-containing structure is provided with a strain-limiting part formed to limit strain generated in relation to the wide wiring laminate structure.
A suspension substrate comprising:
Dependencies are inferred from the claim text.